JPS62118455U - - Google Patents
Info
- Publication number
- JPS62118455U JPS62118455U JP552186U JP552186U JPS62118455U JP S62118455 U JPS62118455 U JP S62118455U JP 552186 U JP552186 U JP 552186U JP 552186 U JP552186 U JP 552186U JP S62118455 U JPS62118455 U JP S62118455U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead frame
- bent
- mounting
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP552186U JPS62118455U (en]) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP552186U JPS62118455U (en]) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118455U true JPS62118455U (en]) | 1987-07-28 |
Family
ID=30787181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP552186U Pending JPS62118455U (en]) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118455U (en]) |
-
1986
- 1986-01-17 JP JP552186U patent/JPS62118455U/ja active Pending